Electronics assembly technology
Active in the technical committee
Technical Officer:
Rummens, François
Technical committee
CEB-BEC 91
Scope
To prepare standards on design, manufacturing and testing of electronic assemblies including the requirements and tests for materials and components used to manufacture circuit boards and electronic assemblies, as well as the formats of electronic data and libraries for describing these products and processes.
The most recent standards
- IEC 61189-2-804:2023 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
- IEC 61189-2-801:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
- IEC 61189-2-803:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
- IEC 61249-6-3:2023 - Materials for printed boards and other interconnecting structures ' Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from 'E' glass for printed boards
- IEC TR 61191-9:2023 - Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
- IEC 61249-2-51:2023 - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
- IEC 61636-2:2023 - Software Interface for Maintenance Information Collection and Analysis (SIMICA) - Part 2: Exchanging Maintenance Action Information via the Extensible Markup Language (XML)
- IEC TR 60068-3-12:2022 - Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
- IEC PAS 61191-10:2022 - Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
- IEC TR 61760-3-1:2022 - Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering ' Guidelines for through hole diameter design with solder paste surface printing method