Electronics assembly technology
Active in the technical committee
Technical Officer:
Rummens, François
Technical committee
CEB-BEC 91
Scope
To prepare standards on design, manufacturing and testing of electronic assemblies including the requirements and tests for materials and components used to manufacture circuit boards and electronic assemblies, as well as the formats of electronic data and libraries for describing these products and processes.
The most recent standards
- IEC PAS 61191-10:2022 - Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
- IEC TR 61760-3-1:2022 - Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering ' Guidelines for through hole diameter design with solder paste surface printing method
- IEC TR 62878-2-9:2022 - Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
- IEC 61189-2-501:2022 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
- IEC 61189-2-807:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA
- IEC 61691-8:2021 - Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual
- IEC 62530-2:2021 - SystemVerilog - Part 2: Universal Verification Methodology Language Reference Manual
- IEC 62530:2021 - SystemVerilog - Unified Hardware Design, Specification, and Verification Language
- IEC 61760-2:2021 RLV - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- IEC 61760-2:2021 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide