Electronics assembly technology
Active in the technical committee
Technical Officer:
Rummens, François
Technical committee
CEB-BEC 91
Scope
To prepare standards on design, manufacturing and testing of electronic assemblies including the requirements and tests for materials and components used to manufacture circuit boards and electronic assemblies, as well as the formats of electronic data and libraries for describing these products and processes.
The most recent standards
- IEC 62529:2024 - Standard for Signal and Test Definition
- IEC 61189-2-808:2024 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
- IEC 61189-2-805:2024 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
- IEC 61189-2-720:2024 - Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
- IEC 61523-4:2023/COR1:2024 - Corrigendum 1 - Delay and power calculation standards - Part 4: Design and Verification of Low-Power, Energy-Aware Electronic Systems
- IEC TR 60068-3-15:2024 - Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
- IEC TS 62878-2-10:2024 - Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
- IEC TR 61760-5-1:2024 - Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
- IEC 63251:2023 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
- IEC 63215-2:2023 - Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices