Electronics assembly technology
Active in the technical committee
Technical Officer:
Rummens, François
Technical committee
CEB-BEC 91
Scope
To prepare standards on design, manufacturing and testing of electronic assemblies including the requirements and tests for materials and components used to manufacture circuit boards and electronic assemblies, as well as the formats of electronic data and libraries for describing these products and processes.
The most recent standards
- IEC 61189-2-807:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA
- IEC 61691-8:2021 - Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual
- IEC 62530-2:2021 - SystemVerilog - Part 2: Universal Verification Methodology Language Reference Manual
- IEC 62530:2021 - SystemVerilog - Unified Hardware Design, Specification, and Verification Language
- IEC 61760-2:2021 RLV - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- IEC 61760-2:2021 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- IEC 60068-2-21:2021 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC TR 62878-2-8:2021 - Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
- IEC 62878-2-602:2021 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
- IEC 61636-1:2021 - Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)