Electronics assembly technology
Active in the technical committee
Technical Officer:
Rummens, François
Technical committee
CEB-BEC 91
Scope
To prepare standards on design, manufacturing and testing of electronic assemblies including the requirements and tests for materials and components used to manufacture circuit boards and electronic assemblies, as well as the formats of electronic data and libraries for describing these products and processes.
The most recent standards
- IEC 60068-2-20:2021 RLV - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
- IEC 60068-2-20:2021 - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
- IEC TR 61191-8:2021 - Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
- IEC 61189-5-301:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
- IEC 61188-6-1:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
- IEC 60194-1:2021 - Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
- IEC 61188-6-2:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
- IEC 61189-5-502:2021 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
- IEC 61189-5-601:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
- IEC 61760-3:2021 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering