Printed Electronics
Active in the technical committee
Technical Officer:
Vinckx, Luc
Technical committee
CEB-BEC 119
Scope
Standardization of terminology, materials , processes, equipments, products and health/safety/environment in the field of printed electronics.
The most recent standards
- IEC 62899-202:2023 - Printed electronics - Part 202: Materials - Conductive ink
- IEC 62899-202:2023 RLV - Printed electronics - Part 202: Materials - Conductive ink
- IEC TR 62899-550-1:2022 - Printed electronics - Part 550-1 : Quality assessment - Framework document on durability testing - Mechanical and thermal testing
- IEC 62899-202-4:2021 - Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
- IEC 62899-201-2:2021 - Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
- IEC TR 62899-402-4:2021 - Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
- IEC 62899-503-3:2021 - Printed electronics - Part 503-3: Quality assessment - Measuring method of contact resistance for the printed thin film transistor - Transfer length method
- IEC 62899-402-3:2021 - Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
- IEC 62899-202-7:2021 - Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
- IEC 62899-302-3:2021 - Printed electronics - Part 302-3: Equipment - Inkjet - Imaging-based measurement of drop direction