Printed Electronics
Active in the technical committee
Technical Officer:
Vinckx, Luc
Technical committee
CEB-BEC 119
Scope
Standardization of terminology, materials , processes, equipments, products and health/safety/environment in the field of printed electronics.
The most recent standards
- IEC 62899-202-8:2024 - Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
- IEC TR 62899-304-1:2023 - Printed electronics - Part 304-1: Equipment - Sintering - Temperature measurement method for photonic sintering system
- IEC 62899-202-10:2023 - Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
- IEC 62899-202-9:2023 - Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
- IEC TR 62899-302-5:2023 - Printed electronics - Part 302-5: Equipment - Inkjet - Significant characteristics of Inkjet Printing
- IEC 62899-202:2023 - Printed electronics - Part 202: Materials - Conductive ink
- IEC 62899-202:2023 RLV - Printed electronics - Part 202: Materials - Conductive ink
- IEC TR 62899-550-1:2022 - Printed electronics - Part 550-1 : Quality assessment - Framework document on durability testing - Mechanical and thermal testing
- IEC 62899-202-4:2021 - Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
- IEC 62899-201-2:2021 - Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates