Semiconductor devices
Active in the technical committee
Chairman: DETREZ, Jean-Luc
Technical Officer:
Delens, Marc
Technical committee
CEB-BEC 47
Scope
To prepare standards for the design, manufacture, use and reuse of discrete semiconductor devices, integrated circuits, display devices, sensors, electronic component assemblies, interface requirements, and microelectromechanical devices, using environmentally sound practices.
The most recent standards
- IEC 62047-40:2021 - Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
- IEC 62435-9:2021 - Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
- IEC 63287-1:2021 - Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- IEC 60747-5-6:2021 - Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
- IEC 60747-5-6:2021 RLV - Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
- IEC 60747-8:2010/AMD1:2021 - Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
- IEC 60747-8:2010+AMD1:2021 CSV - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
- IEC 62047-38:2021 - Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
- IEC 62047-41:2021 - Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
- IEC 60747-5-13:2021 - Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages