Semiconductor devices
Active in the technical committee
Chairman: VANOOST, Dries
Technical committee
CEB-BEC 47
Scope
To prepare standards for the design, manufacture, use and reuse of discrete semiconductor devices, integrated circuits, display devices, sensors, electronic component assemblies, interface requirements, and microelectromechanical devices, using environmentally sound practices.
The most recent standards
- IEC 62951-8:2023 - Semiconductor devices - Flexible and stretchable semiconductor devices - Part 8: Test method for stretchability, flexibility, and stability of flexible resistive memory
- IEC 63364-1:2022 - Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
- IEC 62951-9:2022 - Semiconductor devices - Flexible and stretchable semiconductor devices - Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
- IEC 60747-16-7:2022 - Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
- IEC 60747-16-8:2022 - Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
- IEC 62228-6:2022 - Integrated circuit - EMC evaluation of transceivers - Part 6: PSI5 transceivers
- IEC 60749-37:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-37:2022 RLV - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC TR 63357:2022 - Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
- IEC 62047-42:2022 - Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever